RJR Polymers, Inc. presents paper

“Polymer Bonded LCP Device Housing Enables Selective Thermal Management for RF Device Packages”

RJR is also Presenting a paper at the ARMMS RF & Microwave Society Conference in the UK in April 2010 on; –”Polymer Bonded LCP Device Housing Enables Selective Thermal Management for RF Device Packages”. Join RJR at the next ARMMS Conference: Monday 19th April to Tuesday 20th April 2010 at Milton Hill House.

For details: ARMMS Conference