News

Design - Packaging options expand in RF power:

RF power requirements for commercial wireless applications have evolved dramatically over the past few decades. Today, basestation manufacturers demand power ICs capable of offering higher linearity to support higher order modulation schemes, higher average output power levels, and wider operating bandwidths.  News Article



RJR Polymers Introduces Latest Advances in LCP Technology:

Innovative Semiconductor Packaging Offers Breakthrough in Thermal Conductivity, Design Flexibility. News Article